March 14, 2022
Figure 2: A semi-damascene process flow for BEOL device integration using the new mask set

BEOL integration for the 1.5nm node and beyond

Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented.  These challenges include the need for smaller metal pitches, along with support for […]
March 24, 2020

Exploring the Impact of EUV Resist Thickness on Via Patterning Uniformity using a Litho/Etch Modeling Platform

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation […]
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