August 13, 2021
Figure 1: Courtesy, Sam Zhang, Analog Devices

The Latest Techniques that Provide Insight into Package Stress and Temperature Deformation of a MEMS-based Gyroscope

Transducers 2021 is a prestigious international conference that reviews advances in Solid-State Sensors, Actuators and Microsystems.   At this year’s conference, there were 391 papers presented from 29 different countries with […]
March 24, 2021
MEMS Blog Figure 1 Reverse engineered gyroscope, with suspension spring displayed in the call-out circle

Improving Your Understanding of Advanced Inertial MEMS Design

Micro-Electrical-Mechanical Systems (MEMS) based inertial sensors are used measure acceleration and rotation rate. These sensors are integrated into units to measure motion, direction, acceleration or position, and can be found […]
April 15, 2020
Co-simulation of the package and transducer

Cutting-Edge MEMS Process, Device and Simulation Technologies: IEEE MEMS 2020 Conference Review

The IEEE MEMS conference was held in Vancouver during January 2020. We attended the conference to meet with our customers and to see what new developments are being made in […]
February 20, 2020

The Next Technology Frontier in MEMS Gyroscopes

In MEMS technology development, it is always exciting to see the next technology frontier, the border of the known and the unknown. Talent and hard work (along with ingenuity) can […]
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