December 3, 2021
The Effect of Pattern Loading on BEOL Yield and Reliability during Chemical Mechanical Planarization
CMP (Chemical mechanical planarization) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during semiconductor manufacturing, […]
November 16, 2021
When evaluating shrinking metal linewidths in advanced semiconductor devices, bulk resistivity is not the sole materials property for deriving electrical resistance. At smaller line dimensions, local resistivity is dominated by […]
October 27, 2021
Despite the growing interest in EUV lithography, self-aligned quadruple patterning (SAQP) still holds many technical advantages in pattern consistency, simplicity, and cost. This is particularly true for very simple and […]
September 14, 2021
Profile variation is one of the most important problems during semiconductor device manufacturing and scaling. These variations can degrade both chip yield and device performance. Virtual fabrication can be used […]
June 16, 2021
Introduction With continuing FinFET device process scaling, micro loading control becomes increasingly important due to its significant impact on yield and device performance [1-2]. Micro-loading occurs when the local etch […]
May 27, 2021
People think that semiconductor process simulation libraries should be developed using a perfect theoretical background that is strongly supported by empirical data. This might be true in academic research, where […]
February 22, 2021
While contact gate pitch (GP) and fin pitch (FP) scaling continues to provide higher performance and lower power to FinFET platforms, controlling RC parasitics and achieving higher transistor performance at […]
December 14, 2020
New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes in […]
June 29, 2020
The very first all-electronic memory was the Williams-Kilburn tube, developed in 1947 at Manchester University. It used a cathode ray tube to store bits as dots on the screen’s surface. […]
April 17, 2020
Using failure bin classification, yield prediction and process window optimization to predict and enhance yield Device yield is highly dependent upon proper process targeting and variation control of fabrication steps, […]