December 14, 2020
New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes in […]
April 17, 2020
Using failure bin classification, yield prediction and process window optimization to predict and enhance yield Device yield is highly dependent upon proper process targeting and variation control of fabrication steps, […]
June 25, 2019
To ensure success in semiconductor technology development, process engineers must set the allowed ranges for wafer process parameters. Variability must be controlled, so that final fabricated devices meet required specifications. […]