September 22, 2022
With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of […]
August 18, 2022
Introduction BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line-to-line […]
July 15, 2022
Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often encountered in the form […]
April 15, 2022
One of the fastest ways to predict semiconductor manufacturing final results is by adding together the results of performing individual process steps. Unfortunately, this prediction might ignore critical defects that […]
March 14, 2022
Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for […]
February 11, 2022
Design of Experiments (DOE) is a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and their effect […]
January 4, 2022
When I was a small child, I remember watching a 1966 American sci-fi adventure movie called “Fantastic Voyage” (the Korean title was “Micro Squad”) on an old black-and-white TV. The […]
December 3, 2021
The Effect of Pattern Loading on BEOL Yield and Reliability during Chemical Mechanical Planarization
CMP (Chemical mechanical planarization) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during semiconductor manufacturing, […]
November 16, 2021
When evaluating shrinking metal linewidths in advanced semiconductor devices, bulk resistivity is not the sole materials property for deriving electrical resistance. At smaller line dimensions, local resistivity is dominated by […]
October 27, 2021
Despite the growing interest in EUV lithography, self-aligned quadruple patterning (SAQP) still holds many technical advantages in pattern consistency, simplicity, and cost. This is particularly true for very simple and […]