SEMICON Europa features highly technical content specific to the manufacture of microelectronics (Semiconductors, Photovoltaic, MEMS, flat panel displays, and much more). http://www.semiconeuropa.org/
SEMICON West is the premier annual event for the global microelectronics industry, highlighting the latest innovations, products, processes, and services for the design and manufacture of today’s most sophisticated electronics.
SEMICON West showcases innovations across the microelectronics supply chain, from silicon to system and everything in between. From the latest research on the cutting-edge of transistor technology, to solutions breathing new life into legacy fabs, SEMICON West is the place to connect to what’s new and what’s next in microelectronics. http://www.semiconwest2015.org/
18th International Conference on Solid-State Sensors, Actuators and Microsystems
The world’s premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology. http://transducers2015.org/
The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. https://dac.com/
SITRI and Coventor partner to offer “more then moore” design and process tools to speed development of MEMS-based devices
- SITRI to represent Coventor in China and provide training and support for all Coventor MEMS products
- Expands SITRI’s global ecosystem to accelerate the commercialization of IoT products
Cary, North Carolina and Shanghai, China –– May 18, 2015 — SITRI, the innovation center for accelerating the development and commercialization of “More than Moore” solutions to power the Internet of Things, and Coventor Inc., a leader in automated solutions for developing semiconductor process technology and advanced MEMS devices, announced today they have signed an agreement making SITRI the first organization to provide representation, training and support for Coventor MEMS products within China.
David M. Fried
This is my favorite part of the year at Coventor: We’re about to do another MAJOR release of SEMulator3D. Developers are sprinting to the finish line, customers are clamoring for the newest features. I’d like to start talking about the new features of SEMulator3D 5.0, but one blog certainly won’t cover it all. Let’s get started, and we’ll do this as many times as we need to get it all written down.
MEMS Technical Congress is focused on discussing critical MEMS and sensors supply chain challenges. It brings together foundries, equipment vendors, research groups, large companies, start-ups, buyers, suppliers, and other stakeholders for solutions knowledge, networking and resources to support imminent MEMS and sensors commercialization needs.
By Gerold Schröpfer
The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This conference brings together participants interested in MEMS fabrication with those interested in design tools and methods. While this annual event is always located in Southern Europe, it attracts attendees from both industry and academia from around the world.
It was my pleasure to chair a session titled Co-design for MEMS-based Smart Systems. In recent years, Coventor has made several crucial advancements, now embodied in MEMS+®, to bridge the gap between MEMS device design and system-level simulation. A number of MEMS+ users presented co-simulation results for systems that included inertial sensors, resonators, varactors and micromirrors. It was impressive and gratifying to see their achievements and hear their enthusiasm.
- Guilherme Brondani Torri of imec presented the co-design of a MEMS-CMOS autonomous switched oscillator. He investigated how the dynamic response is affected by the operating point and environmental parameters. The co-simulation of MEMS and circuitry made it possible to identify important issues related to the stability of the proposed oscillator. 
- Gaelle Lissorgues of ESSIE talked about a complete system design for an RF tunable agile filter. The parametric MEMS+ models for MEMS varactors and switches allowed optimizing the design with respect to manufacturing variations. Automated transfer of the MEMS+ model into Verilog-A allows for system-level simulation in ADS including RF performance estimation.
- Alessandro Sanginario of IIT Torino presented a MEMS+ based methodology for MEMS-IC-package co-design. The methodology takes into account the effects of thermally-induced stress on the package on inertial sensor transient behavior. He stated that, being an electronic designer, “it’s fantastic” to have a MEMS-package model in your familiar simulation language. [3, 4]
- Fabio Cenni of ST Micro discussed a new extension to SystemC for MEMS system analysis, named SystemC-AMS/MDVP (Analog/Mixed Signal/Multi-Domain Virtual Prototyping) . This allows co-simulating not only MEMS with electronic hardware, but also with control software. The approach supports different levels of abstraction which allows balancing accuracy and simulation time. Fabio’s presentation was accompanied by a poster, written by Benoit Vernay of Coventor, demonstrating a prototype for automated extraction of a SystemC-AMS reduced-order models from MEMS+. [5, 6, 7]
Finally, my personal favorite was an invited presentation by Johannes Eisenmenger of Carl Zeiss. From a system-integrator point of view, he discussed the opportunities and challenges for EDA tools in developing optical systems. Optimizing such systems with suitable behavioral models is an essential step toward developing products for which new MEMS and other components need to be developed in parallel and their individual specifications depend on mutual interactions and environmental influences. One prominent example is the MEMS mirror matrix, FlexRay, employed in ASML’s 193nm UV lithography equipment for advanced CMOS. 
I want to warmly thank our customers for sharing their work with the MEMS system community.References:
Proceedings of International Conference on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP), Montpellier, France, 27-30 April 2015
 Guilherme BRONDANI TORRI (imec / KU Leuven – Belgium), Jan BIENSTMAN, Xavier ROTTENBERG, Harrie TILMANS (imec) ea, Co-Design of a MEMS-CMOS Autonomous Switched Oscillator
 Gaelle LISSORGUES (ESIEE Paris – France), Pierre NICOLE (THALES Systèmes Aéroportés – France), Julien PAGAZANI (ESIEE – France) ea, A RF tunable Agile Filter: from component to system design
 Alessandro SANGINARIO (Istituto Italiano di Tecnologia – Italy), Sarah ZERBINI (STMicroelectronics – Italy), ea, New design methodology for MEMS-electronic-package co-design and validation for inertial sensor systems
 Michelangelo GROSSO (ST-POLITO – Italy), Giuliana GANGEMI, Salvatore RINAUDO (STMicroelectronics – Italy) ea, Enabling Smart System Design with the SMAC Platform
 Olivier GUILLAUME, Fabio CENNI (STMicroelectronics – France) ea.,SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications
 Fabio CENNI STMicroelectronics – France) ea, Generation of user-defined input stimuli for virtual prototyping of MEMS sensors applications
 Benoit VERNAY, Arnaud KRUST (Coventor – France), ea, SystemC-AMS Simulation of a Biaxial Accelerometer based on MEMS Model Order Reduction
 Johannes Eisenmenger, Opportunities and challenges of Electronic Design Automation of MEMS-ASIC Systems – A system integrator’s perspective (INVITED)