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Software Development Engineer, 3D Geometry – Villebon sur Yvette (91), France

We are seeking a 3D geometry specialist, with a PhD or equivalent experience in 3D mesh generation, voxel modeling, or other similar geometry algorithms. Our voxel-based 3D modeling engine creates highly accurate, topologically complex models of nanometer-scale semiconductor devices. In this key position you will have the opportunity to research, evaluate and implement new algorithms for generating surface and volume meshes from our voxel models. This is a perfect role for candidates who are interested in advanced 3D mesh generation algorithms, and in software engineering in a commercial environment. You will work closely with our semiconductor process technology team to understand the technical requirements of our partners and customers, and your work will enable Coventor and our customers to interface with third-party software tools and partner companies

This is a hands-on software engineering position. You will have the chance to work on a young, innovative product and to work closely with a collaborative, skilled team in both Europe and the USA. Some travel is expected (less than 20%). You will report to the Director of Semiconductor R&D (US-based).

Responsibilities include:

  • Identify and prototype new 3D geometry algorithms for surface and/or volume mesh generation, mesh simplification, correction of self-intersections, etc.
  • Implement mesh generation algorithms in production, commercial C++ code
  • Implement model export features to convert voxel models and/or meshes to various third-party file formats
  • Unit testing and bug fixing
  • Collaborate with our applications team to define requirements for new software features
  • Help troubleshoot customer problems
  • Provide input to and review documentation, tutorials, and user training materials

Required Qualifications:

  • PhD degree in computer science related to 3D geometry, or equivalent work experience
  • Strong expertise in 3D geometry algorithms such as mesh generation, conformal mapping, or voxel modeling
  • Good fundamental 3D math skills, including vector math, matrix math, and transformations
  • Expert coding skills in C++
  • Strong aptitude for object oriented design
  • Ability to clearly communicate technical concepts
  • Must be able to read and understand technical articles and documentation written in English

Desirable Qualifications:

  • Any professional software development experience is a plus, preferably developing a 3D modeling software product
  • Experience with common C++ libraries and technologies such as boost, STL, C++11, template programming, etc.
  • Experience with semiconductor TCAD modeling software
  • Python coding skills

Salary, job title and responsibilities will be commensurate with experience. This opening is in Villebon sur Yvette (91), close to Paris. If you are interested in this opportunity and you are authorized to work in France, e-mail your resume in English to job1834@coventor.com

Imec, Coventor partner to drive advanced CMOS process development through virtual fabrication

Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology

LEUVEN, Belgium & CARY, North Carolina – October 28, 2014 – Belgian nanoelectronics research center imec has announced a joint development project with Coventor, a leading supplier of semiconductor process development tools. The collaboration will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.
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Are Good Engineers Born or Bred?

By Steve Breit, V.P. Engineering

I’ve been doing a lot of interviewing over the last 6 months as we grow our engineering team. I often say that hiring is the most important part of my job and also the hardest part. Like any sensible technology company, Coventor wants to hire the best engineers we can find. Good engineers love engineering. They love to build, to create, to innovate, to solve problems. Good engineers are methodical and persistent, but also bring engineering judgment and intuition that helps them arrive at solutions efficiently. Good engineers can’t help doing engineering – it’s who they are. Over the years, I’ve observed that good engineers are way more productive than mediocre engineers. The difference in productivity can be astounding, in excess of 2 or 3X for the best engineers. The trick, at least during the hiring process, is to discern which candidates are the good engineers. You can’t just look at academic degrees, skills claimed, or work experience to tell the difference. read more…

MEMS+, Bringing MEMS into the Electronic World

by Paul McLellan, SemiWiki

One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics necessary to process the signal from the sensor and end up with something much closer to “we’re crashing, deploy the airbags” versus “we’re OK, don’t fire off the airbags.”

The design of the MEMS devices themselves are typically done with some form of finite-element analysis (FEA), a very general approach to designing mechanical structures. However, these models of the device are very complex and slow to evaluate due to the huge number of degrees of freedom. This is fine for designing the device itself but for working with the electronics a simpler model of the device is required that is accurate enough for the purpose but is also fast to evaluate.
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Got Air Gaps?

By Ryan Patz, Applied Materials

NAND Flash memory has become the driver of semiconductor technology and the four primary manufacturers are pushing hard to continue scaling in order to preserve margins. Smartphone growth continues to increase demand and revenue close to $30 Billion is expected for 2014. 3D NAND is not quite ready for “prime time” so significant effort is required to resolve current 2D limitations to enable 1x nm devices. The main process integration challenges include patterning the very small features (often employing quadruple spacer patterning technology), fill issues due to aspect ratios >10 and cell to cell interference [1].
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Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers

By Francoise von Trapp
3D In-Depth, EDA Tools
http://www.3dincites.com/

MEMS-Electrostatic-Comb-Drive-500x250

I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s a good way to learn about the synergies and to cross-pollinate information. Today was one of those days. I interviewed Steve Breit, PhD, VP of Engineering, Coventor, supplier of design automation software for MEMS and semiconductor applications. Breit reminded me that through silicon via technology (TSV), which is critical for 3D IC, owes a debt to MEMS. He’s right about that. So I figure a nod to MEMS now and again on 3D InCites isn’t out of place.

Breit briefed me on the company’s latest version of its MEMS+ modeling environment for accelerated development of advanced MEMS devices and systems, and what the improvements mean for ASIC designers who need to integrate MEMS devices into their system design.
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