“A View from the Trenches” Features Experts from Samsung, IBM, GLOBALFOUNDRIES, Micron, IMEC and ST Microelectronics
WASHINGTON, DC – December 2, 2013 – Coventor®, Inc., a leading supplier of virtual fabrication software to accelerate the development of new manufacturing processes, will host an expert roundtable discussion at the 2013 edition of IEDM (December 7-11, 2013. Washington, DC). The discussion will provide an in-depth and comprehensive view of the current and next generation of challenges facing IC designers and manufacturers as process technologies head to unprecedented levels of complexity, cost and technical difficulty.
Participants in the roundtable will include:
- Dr. Brian Green, Senor Engineer/FEOL Architect: IBM
- Mark Fisher, Senior Research Engineer: Micron
- Dr. Andy Wei, Principle Member of Technical Staff – 10nm: GLOBALFOUNDRIES
- Jaouen Herve, Director, Modeling & Simulation: ST Microelectronics
- Sean Lian, Director/Technology Lead: Samsung
- Laith Altimime, Director CMOS Technology & Design: IMEC
- David Fried, CTO-Semiconductor: Coventor, Inc.
Panelists will examine the changing business dynamics and most pressing technical issues faced by the world’s leading IC companies. Topics to be covered include: FinFETS, 3D ICs, Flash memory, double patterning, advance modeling and simulation techniques, process variation challenges, and accelerating yield ramps.
- Tuesday, December 10
- Churchill Embassy Row Hotel: Kalorama Ballroom (The hotel is right across the street from the Washington Hilton where IEDM is held.)
- Doors open at 5:30PM and the discussion begins at 6:30PM.
- Cocktail and hors d’oeuvres to be served
Space is limited so reserve your place: Email: RSVP-to-COVENTOR@coventor.com.
Coventor, Inc. is the market leader in automated design solutions for micro-electromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. More information is available at http://www.coventor.com.
MEMS+ 4.0 software adds capability to export Verilog-A models and full 64-bit implementation to significantly enhance design efficiency and throughput
CARY, North Carolina – October 28, 2013 – Coventor®, Inc., the leading supplier of design automation solutions for micro-electromechanical systems (MEMS), today announced its MEMS+® 4.0 software suite for accelerating development of advanced MEMS devices and systems. The MEMS+ suite enables MEMS and IC designers to rapidly explore and optimize designs in parallel in the MathWorks MATLAB® and Cadence Virtuoso® environments. The MEMS+ 4.0 release features a new capability to export models in Verilog-A format and a full 64-bit implementation that allows more accurate modeling of complex MEMS sensors and actuators.
The MEMS+ 4.0 suite is a key part of Coventor’s platform for MEMS development, which also includes the CoventorWare® and SEMulator3D® software suites. The platform provides a complete solution for designing and verifying state-of-the-art accelerometers, gyroscopes, microphones and many other types of MEMS. This latest release of the MEMS+ suite extends the scope of the platform by providing a ‘tunable’ accuracy-versus-speed approach for co-designing MEMS and integrated circuits (ICs) and compatibility with more EDA analog/mixed-signal simulation environments. read more…
Latest release of the industry’s only ‘virtual fabrication’ platform delivers advanced physics-driven predictive modeling capabilities aimed at reducing silicon learning cycles and costs
CARY, North Carolina – May 28, 2013 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced immediate availability of the SEMulator3D® 2013 software platform. SEMulator3D 2013 brings unprecedented physical accuracy and predictive modeling capabilities to process development and integration. This milestone release expands the value of ‘virtual fabrication’ to the broader semiconductor ecosystem in order to dramatically reduce silicon learning cycles and the billions of dollars spent reaching manufacturing readiness. read more…
MEMS+ 3.0 software platform delivers new fluidic, package and noise simulation capabilities; an expanded component library; and performance enhancements
CARY, North Carolina – February 4, 2013 – Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today announced immediate availability of its new MEMS+® 3.0 design platform that accelerates development of complex 3D systems with state-of-the-art actuators, accelerometers and gyroscopes, microphones and other types of MEMS devices.
Advanced 3D Modeling in Newest Version of MEMS+ Platform
MEMS+ 3.0 features new fluidic, package and noise simulation capabilities; an expanded component library; and performance enhancements to accelerate overall throughput for complex designs
CARY, North Carolina – November 7, 2012 – Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today introduced the MEMS+® 3.0 design platform, the latest version of its unique MEMS+IC co-design platform aimed at accelerating development of complex 3D systems with state-of-the-art actuators, accelerometers and gyroscopes, microphones and other types of MEMS devices. read more…
IBM veteran with deep experience in advanced process technology including SOI and FinFETs to lead strategic direction in the development efforts for virtual fabrication solutions for 22nm and beyond
CARY, North Carolina – August 7, 2012 – Coventor®, Inc. the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the addition of renowned semiconductor process expert David Fried, Ph.D. to its executive team. As Chief Technology Officer (CTO) for its semiconductor development products, Fried will oversee the company’s strategic direction and implementation of its SEMulator3D virtual fabrication 3D process modeling solution. read more…