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Coventor in the News – Silicon Photonics

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Coventor in the News

Photonics in Silicon R&D Toward Tb/s

By Ed Korczynski, Sr. Technical Editor, Semiconductor Manufacturing & Design

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The client:server computing paradigm colloquially referred to as the “Cloud” results in a need for extremely efficient Cloud server hardware, and from first principles the world can save a lot of energy resources if servers run on photonics instead of electronics. Though the potential for cost-savings is well known, the challenge of developing cost-effective integrated photonics solutions remains. Today, discrete compound-semiconductor chips function as transmitters, multiplexers (MUX), and receivers of photons, while many global organizations pursue the vision of lower-cost integrated silicon (Si) photonics circuits.

Work on photonics chips—using light as logic elements in an integrated circuit—built in silicon (Si) has accelerated recently with announcements of new collaborative research and development (R&D) projects. Leti, an institute of CEA Tech, announced the launch of a European Commission Horizon 2020 “COSMICC” project to enable mass commercialization of Si-photonics-based transceivers to meet future data-transmission requirements in data centers and super computing systems.

The Leti-coordinated COSMICC project will combine CMOS electronics and Si-photonics with innovative fiber-attachment techniques to achieve 1 Tb/s data rates. These scalable solutions will provide performance improvement an order of magnitude better than current VCSELs transceivers, and the COSMICC-developed technology will address future data-transmission needs with a target cost per bit that traditional wavelength-division multiplexing (WDM) transceivers cannot meet. The project’s 11 partners from five countries are focusing on developing mid-board optical transceivers with data rates up to 2.4 Tb/s with 200 Gb/s per fiber using 12 fibers. The devices will consume less than 2 pJ/bit. and cost approximately 0.2 Euros/Gb/s.

Figure 1: Schematic of COSMICC on-board optical transceiver at 2.4 Tb/s using 50 Gbps/wavelength, 4 CWDM wavelengths per fiber, 12 fibers for transmission and 12 fibers for reception. (Source: Leti)

Figure 1: Schematic of COSMICC on-board optical transceiver at 2.4 Tb/s using 50 Gbps/wavelength, 4 CWDM wavelengths per fiber, 12 fibers for transmission and 12 fibers for reception. (Source: Leti)

A first improvement will be the introduction of a silicon-nitride (SiN) layer that will allow development of temperature-insensitive MUX/DEMUX devices for coarse WDM operation, and will serve as an intermediate wave-guiding layer for optical input/output. The partners will also evaluate capacitive modulators, slow-wave depletion modulators with 1D periodicity, and more advanced approaches. These include GeSi electro-absorption modulators with tunable Si composition and photonic crystal electro-refraction modulators to make micrometer-scale devices. In addition, a hybrid III-V on Si laser will be integrated in the SOI/SiN platform in the more advanced transmitter circuits.

Meanwhile in the United States, Coventor, Inc. is collaborating with the Massachusetts Institute of Technology (MIT) on photonics modeling. MIT is a key player in the AIM Photonics program, a federally funded, public-private partnership established to advance domestic capabilities in integrated photonic technology and strengthen high-tech U.S.-based manufacturing. Coventor will provide its SEMulator3D process modeling platform to model the effect of process variation in the development of photonic integrated components.

“Coventor’s technical expertise in predicting the manufacturability of advanced technologies is outstanding. Our joint collaboration with Coventor will help us develop new design methods for achieving high yield and high performance in integrated photonic applications,” said Professor Duane Boning of MIT. Boning is an expert at modeling non-linear effects in processing, many years after working on the semiconductor industry’s reference model for the control of chemical-mechanical planarization (CMP) processing.

—E.K.

See original article here

 

 

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Coventor’s Technology Roundtable at IEDM 2016

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Coventor Spearheads Discussion on Navigating Future Semiconductor Yield, Reliability and Cost Challenges

CARY, NC– December 6, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), is sponsoring an advanced semiconductor technology panel on Tuesday, December 6 in San Francisco, California at the 2016 IEDM Conference. The panel is entitled “BEOL Barricades: Navigating Future Semiconductor Yield, Reliability and Cost Challenges”.

The panel discussion will explore major questions in advanced semiconductor development, including: read more…

SEMulator3D from Coventor Wins “Best of the West” Product Award

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Coventor’s Virtual Fabrication Platform Recognized for Its Significant Impact on Improving Electronics Manufacturing

CARY, NC– July 27, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced its SEMulator3D® 6.0 won the 2016 “Best of the West” award sponsored by Solid State Technology and SEMI at SEMICON West.  This prestigious industry award recognizes the product and technology developments that contributed the most significant improvements to the electronics manufacturing supply chain.  Coventor’s SEMulator3D was selected for the significant financial, scientific and social impact it has had on the industry.     read more…

Coventor to Collaborate with MIT for Photonics Process Modeling

Coventor will offer expertise and tools to support MIT’s role in AIM Photonics

CARY, NC– November 15, 2016 – Coventor, a leading supplier of semiconductor process development tools, today announced that it will collaborate with the Massachusetts Institute of Technology (“MIT”) on silicon photonics process modeling. MIT is a key player in the AIM Photonics program, a federally funded, public-private partnership established to advance domestic capabilities in integrated photonic technology and strengthen high-tech U.S.-based manufacturing. Coventor will provide its SEMulator3D® process modeling platform to model the effect of process variation in the development of photonic integrated components. Integration of photonics with conventional CMOS technology is needed for next-generation scientific, industrial and consumer applications ranging from data communications to metrology to aerospace applications. read more…

Registration for Worldwide MEMS Design Contest Opens

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Registration for Worldwide MEMS Design Contest Opens

Cadence, X-FAB, Coventor and Reutlingen University offering a first prize of $5000 for leading-edge ingenuity in MEMS and mixed-signal designs

SAN JOSE, Calif., November 2, 2016Cadence Design Systems, Inc. (NASDAQ: CDNS), Coventor, X-FAB and Reutlingen University have teamed up to launch the MEMS design contest to encourage the development of innovative MEMS and mixed-signal designs. The first-prize winner will receive a $5000 cash award, have their design manufactured at X-FAB’s wafer production facilities and get a free one-year license of Coventor’s MEMS design software. The second and third prize winners will receive $2,000 and $1,000 cash prizes respectively, along with a private tour of X-FAB’s foundry facilities. The contest registration is open until December 31, 2016, and design teams are encouraged to enter the contest at http://info.coventor.com/mems-design-contest-2018. read more…

Coventor to Highlight 3D Virtual Fabrication Breakthroughs at 2016 SEMICON West Conference

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CARY, NC – July 5, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the 46th annual SEMICON West conference in San Francisco, CA from July 12 – 14, 2016.   Coventor will showcase SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform, which has also been named a finalist in the Best of the West awards.   Along with software demonstrations highlighting the newest features of SEMulator3D 6.0 in its booth # 2622, Coventor will showcase how its virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies. read more…

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Coventor Participates in A*STAR IME’S Third Consortium to Develop MEMS Technologies for Industrial IOT, Automotive and Indoor Navigation Applications

A*STAR IME’S CONSORTIUM TO DEEPEN CAPABILITIES IN MEMS TECHNOLOGIES FOR INDUSTRIAL INTERNET OF THINGS, AUTOMOTIVE, AND INDOOR NAVIGATION APPLICATIONS

A*STAR IME’s collaborative partnership with industry will enable the development of cutting-edge industrial-grade sensors to heighten performance and achieve cost-effectiveness for MEMS devices

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Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities

Coventor’s Virtual Fabrication Platform Addresses Increasingly Complex Semiconductor Process Design Challenges

CARY, NC– June 6, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features, usability enhancements and a new add-on capability for electrical analysis. Along with SEMulator3D 6.0, Coventor is releasing an all-new SEMulator3D Electrical Analysis add-on component that allows seamless resistance and capacitance extraction directly from SEMulator3D process-predictive 3D models. read more…

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