By Mark Lapedus
In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND.
3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash drives and other products.
There is still huge demand for today’s planar NAND, but this technology is basically reaching its physical scaling limit. Today, NAND flash vendors are shipping planar parts at the mid-1xnm node regime, which represents the end of the scaling road for the technology.