Blog


3D NAND Race Faces Huge Tech And Cost Challenges

Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead.

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Challenges and Solutions for Silicon Wafer Bevel Defects during 3D NAND Flash Manufacturing

By: Pradeep Nanja, Software Applications Engineer

Introduction

As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between the wafer center and the wafer edge. Industry participants are working to reduce defect density at the wafer edge to improve overall wafer yield. Attention has focused on common wafer bevel defects such as peeling (or delamination), particle contamination, arcing, and micromasking to improve yield. We will now review these defects in detail and discuss ways to prevent them. read more…

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Controlling IC Manufacturing Processes For Yield

Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing and analyze it quickly enough to be able to impact yield and time to market has begun. That includes more customized sensors, machine learning and AI systems that can separate out critical data quickly enough to impact ongoing processes, as well as longer-term data collection to identify patterns. It also involves being able to quickly eliminate data that is unnecessary.

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Connecting Wafer Level Parasitic Extraction and Netlisting

By: Michael Hargrove, SP&I Engineer

The semiconductor technology simulation world is typically divided into device-level TCAD (technology CAD) and circuit-level compact modeling. Larger EDA companies provide high-level design simulation tools that perform LVS (layout vs. schematic), DRC (design rule checking), and many other software solutions that facilitate the entire design process at the most advanced technology nodes. In this blog, I’d like to focus on the design of silicon-level connections between devices and wires in the backend-of-line (BEOL). These connections run across chips and connect various nodes to each other, and ultimately form circuits on the device. read more…

EDA and Foundry Collaboration Speeds MEMS Sensor Design

New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is no exception to this trend1. Its growth has been driven mainly by automotive applications such as tire pressure management system (TPMS) regulations in China, fuel and ignition systems, thermal systems, oil-pressure monitoring, and indoor and outdoor navigation systems. Easy to customize and integrate, miniature, sensitive, accurate and low-power MEMS devices are especially well-suited to the accuracy, power consumption, sensitivity and miniaturization that pressure sensors require.

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EDA and Foundry Collaboration Speeds MEMS Sensor Design

By Christine Dufour (Coventor) and Viraja Sharma (X-FAB)

Pressure Sensor (Courtesy X-FAB)

Pressure Sensor (Courtesy: X-FAB)

New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is no exception to this trend1. Its growth has been driven mainly by automotive applications such as tire pressure management system (TPMS) regulations in China, fuel and ignition systems, thermal systems, oil-pressure monitoring, and indoor and outdoor navigation systems. Easy to customize and integrate, miniature, sensitive, accurate and low-power MEMS devices are especially well-suited to the accuracy, power consumption, sensitivity and miniaturization that pressure sensors require. read more…

Transducers 2019 – Berlin, Germany – June 23-27, 2019

Coventor is exhibiting!

IITC/ MAM – Brussels, Belgium – June 3-6, 2019

Coventor / Lam is participating!