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Accelerating the Development of Dry Etch Processes during Feature Dependent Etch

In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (Figure 1). This has an impact on […]

An Explanation of New MEMS Microphone Technology and Design

What is a MEMS Microphone? MEMS (microelectromechanical systems) microphones are micro-scale devices that provide high fidelity acoustic sensing and are small enough to be included in a tightly-integrated electronic product. […]

Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip, to encompassing a growing number of schemes for interconnecting multiple types of chips. […]

Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models

Process engineers and integrators can use virtual process modeling to test alternative process schemes and architectures without relying on wafer-based testing. One important aspect of building an accurate process model […]

Semiconductor Memory Evolution and Current Challenges

The very first all-electronic memory was the Williams-Kilburn tube, developed in 1947 at Manchester University. It used a cathode ray tube to store bits as dots on the screen’s surface. […]

Enabling Better MEMS from Concept to High Volume Manufacturing

Lam Research® is one of the top equipment suppliers in the semiconductor ecosystem. As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler […]

Introducing Nanosheets into Complementary-Field Effect Transistors (CFET)

UNDERSTANDING THE BENEFITS AND CHALLENGES OF A NEW, NEXT-GENERATION SEMICONDUCTOR ARCHITECTURE In our November 2019 blog [1], we discussed using virtual fabrication (SEMulator3D®) to benchmark different process integration options for […]

Identifying and Preventing Process Failures at 7nm

Using failure bin classification, yield prediction and process window optimization to predict and enhance yield Device yield is highly dependent upon proper process targeting and variation control of fabrication steps, […]

Cutting-Edge MEMS Process, Device and Simulation Technologies: IEEE MEMS 2020 Conference Review

The IEEE MEMS conference was held in Vancouver during January 2020. We attended the conference to meet with our customers and to see what new developments are being made in […]

Exploring the Impact of EUV Resist Thickness on Via Patterning Uniformity using a Litho/Etch Modeling Platform

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation […]

The Next Technology Frontier in MEMS Gyroscopes

In MEMS technology development, it is always exciting to see the next technology frontier, the border of the known and the unknown. Talent and hard work (along with ingenuity) can […]

Identifying DRAM Failures Caused by Leakage Current and Parasitic Capacitance

Leakage current has been a leading cause of device failure in DRAM design, starting with the 20nm technology node. Problems with leakage current in DRAM design can lead to reliability […]

An Introduction to Semiconductor Process Modeling: Process Specification and Rule Verification

Semiconductor process engineers would love to develop successful process recipes without the guesswork of repeated wafer testing. Unfortunately, developing a successful process can’t be done without some work. This blog […]

A Study of Next Generation CFET Process Integration Options

Decision making is a critical step in semiconductor technology development. R&D semiconductor engineers must consider different design and process options early in the development of a next-generation technology. Established techniques […]

New Product Announcement – CoventorMP 1.2

We are very pleased to announce the release of our latest MEMS design software, CoventorMP 1.2. This release has been enriched to improve the accuracy of device models and extend the […]

How FinFET Device Performance is Affected by Epitaxial Process Variations

As the need to scale transistors to ever-smaller sizes continues to press on technology designers, the impact of parasitic resistance and capacitance can approach or even outpace other aspects of […]

Advanced Patterning Techniques for 3D NAND Devices

Driven by Moore’s law, memory and logic semiconductor manufacturers pursue higher transistor density to improve product cost and performance [1]. In NAND Flash technologies, this has led to the market […]

Controlling Variability using Semiconductor Process Window Optimization

To ensure success in semiconductor technology development, process engineers must set the allowed ranges for wafer process parameters. Variability must be controlled, so that final fabricated devices meet required specifications. […]

Challenges and Solutions for Silicon Wafer Bevel Defects during 3D NAND Flash Manufacturing

As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between the wafer […]

Connecting Wafer Level Parasitic Extraction and Netlisting

The semiconductor technology simulation world is typically divided into device-level TCAD (technology CAD) and circuit-level compact modeling. Larger EDA companies provide high-level design simulation tools that perform LVS (layout vs. […]

EDA and Foundry Collaboration Speeds MEMS Sensor Design

Pressure Sensor (Courtesy: X-FAB) New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is […]

Improving SAQP Patterning Yield using Virtual Fabrication and Advanced Process Control

Advanced logic scaling has created some difficult technical challenges,  including a requirement for highly dense patterning. Imec recently confronted this challenge, by working toward the use of Metal 2 (M2) […]

Innovative Solutions to Increase 3D NAND Flash Memory Density

3D NAND flash memory has enabled a new generation of non-volatile solid-state storage useful in nearly every electronic device imaginable. 3D NAND can achieve data densities exceeding those of 2D NAND […]

Analyzing Worst-Case Silicon Photonic Device Performance Through Process Modeling and Optical Simulation

This blog is a summary of a technical paper given at an SPIE Photonics conference. Read the full paper here. Background Silicon photonics is an emerging and rapidly-expanding design platform […]

3D NAND: Challenges beyond 96-Layer Memory Arrays

Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the […]

A Review of Silicon Photonics: Using Process Simulation to Design Silicon Photonics Devices

With the end of Moore’s Law rapidly approaching, or as some folks say – “already here”, new applications of older technologies are gaining attention. One specific area of interest is […]

Everything You Need to Know about FDSOI Technology – Advantages, Disadvantages, and Applications of FDSOI

This blog is a summary of a technical and business review of FDSOI technology. Read the full paper here. Over the past decades, transistor feature size has continuously decreased, leading […]

Practical Methods to Overcome the Challenges of 3D Logic Design

What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start […]

LiDAR: How MEMS is enabling the new trend in spatial sensing

You’ve probably heard a lot about LiDAR. It stands for Light Detection and Ranging, and it’s playing a central role in many emerging technologies like autonomous vehicles, robotics and home […]

Future Directions in MEMS Technology: Results from the 2018 MEMS Design Contest

At CDNLive in 2015, we joined with representatives from Cadence and X-FAB to discuss the possibility of sponsoring a MEMS design contest. At the time, the sponsoring companies were developing […]

When Will Self-Driving Cars Become a Reality?

Self-driving cars have been all the rage in both the trade press and popular press in recent years. I prefer the term “autonomous vehicles” which more broadly captures the possibilities, […]

Transistor-Level Performance Evaluation Based on Wafer-Level Process Modeling

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation” in which I described the seamless connection between the SEMulator3D® virtual wafer fabrication […]

Advanced 3D Design Technology Co-Optimization for Manufacturability

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due […]

The Challenge of Modeling the Interaction between MEMS Inertial Sensors and their Packaging

Simulation of Thermal Effects on MEMS Performances MEMS inertial sensors, such as Accelerometers and Gyroscopes, have been commercially successful in the consumer marketplace, where reduced size and cost are more […]

Improving Patterning Yield at the 5 nm Semiconductor Node

Engineering decisions are always data-driven.  As scientists, we only believe in facts and not in intuition or feelings. At the manufacturing stage, the semiconductor industry is eager to provide data […]

How To Build A Better MEMS Microphone

Here at Coventor, we are seeing a lot of interest in simulating noise, particularly for condenser microphones. With any transducer noise reduction is always a plus, and with microphones there […]

Comparing MEMS and the RMS Titanic: Some Thoughts from the IEEE MEMS 2018 Conference

How are MEMS and Large Ships Alike? MEMS 2018 was held in Belfast, Northern Ireland this year, on the site where the RMS Titanic was built. On exhibit was the […]

Future Outlook: The Advantages of Fully Depleted Silicon on Insulator (FD-SOI) Technology

If my memory serves me well, it was at the 1989 Device Research Conference where the potential merits of SOI (Silicon on Insulator) technology were discussed in a heated evening […]

What the Experts Think: Delivering the Next 5 Years of Semiconductor Technology

Coventor recently sponsored an expert panel discussion at IEDM 2017 to discuss how we might advance the semiconductor industry into the next generation of technology.  The panel discussed alternative methods […]

Delivering the Next 5 Years of Semiconductor Technology

New, advanced semiconductor processing and architectural technologies take years to perfect and put into production. In the meantime, semiconductor customers continue to demand faster, smaller and higher functioning devices. Semiconductor […]

Reducing BEOL Parasitic Capacitance using Air Gaps

Reducing back-end-of-line (BEOL) interconnect parasitic capacitance remains a focus for advanced technology node development. Porous low-k dielectric materials have been used to achieve reduced capacitance, however, these materials remain fragile […]

Using Advanced Statistical Analysis to improve FinFET transistor performance

Trial and error wafer fabrication is commonly used to study the effect of process changes in the development of FinFET and other advanced semiconductor technologies. Due to the interaction of upstream […]

Silicon Photonics: Solving Process Variation and Manufacturing Challenges

As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide shape and can result […]

Are Good Engineers Born or Bred?

I’ve been doing a lot of interviewing as we grow our engineering team. I often say that hiring is the most important part of my job and also the hardest […]

The Future of MEMS Design: Making MEMS Design More Like CMOS Design

MEMS-based component suppliers want to rapidly ramp their designs into high-volume production. This demand is driving MEMS suppliers to focus on ways to more efficiently re-use established process steps, stacks […]

3D Model-Based Process Control for the Future of Smart Manufacturing

David Fried, CTO of Coventor, gave a presentation entitled “3D Model-Based Process Control for the Future of Smart Manufacturing” at SEMICON West 2017. Listen to this presentation to gain an understanding […]

CMOS Image Sensors (CIS): Past, Present & Future

Over the last decade, CMOS Image Sensor (CIS) technology has made impressive progress. Image sensor performance has dramatically improved over the years, and CIS technology has enjoyed great commercial success […]

What drives SADP BEOL variability?

Until EUV lithography becomes a reality, multiple patterning technologies such as triple litho-etch (LELELE), self-aligned double patterning (SADP), and self-aligned quadruple patterning (SAQP) are being used to meet the stringent […]

Photoresist shape in 3D: Understanding how small variations in photoresist shape significantly impact multi-patterning yield

Things were easy for integrators when the pattern they had on the mask ended up being the pattern they wanted on the chip. Multi-patterning schemes such as Self-Aligned Double Patterning […]

MEMS Microphones – A Bright Spot among Commoditized Consumer Sensors

MEMS microphones have emerged as a bright spot among consumer sensors, which in general are going through a rapid commoditization and profit-squeezing trend. To understand what’s driving the MEMS microphone […]

Semiconductor Process Development: Finding a Faster Way to Profitability

Building a chip fabrication facility requires billions of dollars in investment for land, buildings, processing equipment, chemical and hazardous material safety, not to mention the deployment of hundreds of highly […]

The Value of Integrating Process Models with TCAD Simulation (and some tips on how to do it)

Nowadays, novel semiconductor technologies have brought complex process flows to the fab. These process flows are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful […]

BEOL Barricades: Navigating Future Yield, Reliability and Cost Challenges

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. We […]

Bringing Advanced Semiconductor Manufacturing Technologies to Higher Education

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of […]

Achieving the Vision of Silicon Photonics Processing

With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable.   Copper cabling cannot keep up with the upcoming data […]

Design Process Technology Co-Optimization for Manufacturability

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products.   Meeting yield and product cost targets is a continuous challenge, due to new device […]

Coventor Makes History (Museum)

Organizers of the 53rd Design Automation Conference (DAC) hosted an art show to highlight the creativity and artistry that goes into much of the work in the electronics industry.  Coventor […]

IMEC Partner Technical Week Review

IMEC Partner Technical Week Review In March 2016, Coventor was invited to the biannual Partner Technical Week (PTW) at IMEC in Leuven, Belgium. IMEC, a world-leading research group in nanotechnology, […]

Introducing SEMulator3D Version 5.2

The SEMulator3D software platform has once again been updated and improved with significantly more features, making it the industry leader in semiconductor virtual fabrication.  In order to view massively large […]

The Future of MEMS Sensor Design and Manufacturing

There are three industry trends that I believe will have major implications for motion sensor design and manufacturing and, more generally, for other types of high-volume MEMS such as microphones: […]

Will directed self-assembly pattern 14nm DRAM?

But first, more generally, will directed self-assembly (DSA) join Extreme Ultraviolet (EUV) Lithography and next generation multi-patterning techniques to pattern the next memory and logic technologies?  Appealing to the wisdom […]

Advanced Lithography and Process Variation Modeling Using SEMulator3D

One of the top and probably toughest challenges that process integrators are facing today in a silicon fab is process variability. As a former process integrator working hard to ramp […]

MEMS+ 6.0 takes on MEMS/IoT integration challenges

We announced the release of the latest version of our MEMS+ design platform this week, MEMS+ 6.0. This release contains many new features and performance improvements that existing customers will appreciate as well as new capabilities that address key challenges of integrating MEMS with IoT devices. There’s far too much to talk about in one blog, so we will focus this one on why MEMS are critical to IoT and the key MEMS/IoT integration challenges MEMS+ 6.0 addresses. Subsequent blogs will expand on each of these challenges and our solutions.

SEMulator3D 5.0 – It’s ALMOST HERE!!!!

I said I’d follow up with another blog about new features and capabilities SEMulator3D 5.0… and I’m running out of time. The Gold release is less than a week away!!In […]

Collaboration Brings Fast Analysis to Acoustic Resonator Design

After some lively conversations with the top researchers in MEMS acoustic resonators during the 2014 Sensors and Actuators Workshop (familiarly known to the MEMS community as “Hilton Head”) we were […]

Don’t miss new Cloud-Based 3D Design-Technology Checking (3D-DTC) demo at DAC!

DAC 2015 is in full swing in San Francisco this week, and Coventor is there again. But this year, we’re also doing a special joint demonstration with Silicon Cloud International. […]

SEMulator3D 5.0 – It’s COMING!!!

This is my favorite part of the year at Coventor: We’re about to do another MAJOR release of SEMulator3D. Developers are sprinting to the finish line, customers are clamoring for […]

MEMS System Co-Design at DTIP

The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This […]

A Lego Block Approach to MEMS Design

The Smart Systems Integration conference took place in Copenhagen on March 10-12, 2015. We were invited to join a panel discussion with the title “Towards a “Lego block principle” for […]

Defect Evolution in 3D NAND Flash

3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology […]

Modeling as a Foundation for TSensors Acceleration

I gave a talk with the same title as this blog at the TSensors Summit held in La Jolla, California on November 12-13. The ‘T’ in TSensors stands for Trillion […]

Breakthrough MEMS Models for System and IC Designers

We just rolled out MEMS+ 5.0 with lots of new capabilities for our users. I discussed some of the new features, support of scanning mirrors in particular, in a previous […]

The Unsung Heroes of CoventorWare

The CoventorWare 2014 release has been announced and is now available to customers. I presided over the first release of CoventorWare in 2001 and eight major releases since then with […]

Semicon West attracts the entire value chain to address 3D chip manufacturing challenges

Semicon West is one of the iconic conferences in the semiconductor industry and annually attracts the key movers and shakers who are involved with how we are going to keep […]

Mid summer release of SEMulator3D adds more accuracy for deposition & CMP

Today we officially released SEMulator3D 2014.100. Typically, I wouldn’t be so excited about a “point release”, but this is clearly the biggest interim software release in recent SEMulator3D memory. We’ve […]

Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation

Most process/device simulation tools are TCAD-based. By this, I mean they share a common platform which connects the process simulator to the device simulator, usually using the same mesh structure. […]

What will the next 30 years of MEMS bring?

Coventor attended the Solid State Sensors, Actuators and Microsystems Conference last week, known simply as “Hilton Head” to the North American MEMS and nanotechnology community. This is a delightful conference […]

Challenges in 3D NAND Flash Processing

With 2D planar NAND flash hitting scaling issues at sub-20nm technology nodes, 3D NAND flash has become all the rage. Instead of restricting memory cells to a single plane and […]

Sneak Peak: New Capabilities for Micro Scanning and Projection Mirrors

Once again we are entering the final phase of a MEMS+ release cycle. We are tying up loose endsfor for another exciting release, over the summer, of our unique MEMS […]

Are MEMS bolometers the next big thing?

I often feel that Coventor is in the crow’s nest for spotting trends in the MEMS industry because our customers use design and simulation software early in the product development […]

SEMulator3D 2014: Why this is big news

We’re right on the cusp of the SEMulator3D 2014 release. This has been a big release in the making, and I know I’m not alone in my excitement as we […]

Some Thoughts on 3D Integration and How to Better Understand its Complexity

As semiconductor technology scales into the 20nm node and beyond, the process complexity, electrical performance and circuit density tradeoff becomes extremely difficult to optimize. As the demand for increased density, […]

3D printed model of FinFET attracts attention at SPIE Conference

3D printing has become all the rage in many areas, from home hobbyists to high-end industrial applications. The convenience, flexibility, functionality and decreasing price for printing things in 3D makes […]

IEEE Conference Highlights the MEMS Opportunity

The recent IEEE Conference on MEMS, held in San Francisco, was one of the better gatherings of its sort, partly due to the location and its proximity to so many […]

This is not your Father’s TCAD

When I started my semiconductor career, in the midst of quarter-micron CMOS, the work of technology development was very different. We basically knew how to fabricate transistors and interconnects. The […]

MEMS 2014 Conference in San Francisco

One of the highlight events every year on the MEMS calendar is the IEEE International Conference on MEMS. This is a prestigious gathering that attracts the true thought leaders in […]

Best wishes for the holidays from Coventor

From your friends and partners at Coventor around the world, we wish you best wishes for a safe and happy holiday season, and a prosperous New Year.As always, we are […]

Industry experts debate next generation of process development challenges

At the 2013 edition of the IEDM conference held this month in Washington, DC, some of the brightest minds in the design and manufacture of semiconductors gathered to discuss trends […]

Toward Smarter Design of Smart Systems

Without MEMS today’s smart phones wouldn’t be called “smart”. Be it motion sensing with accelerometers and gyroscopes, noise cancelling with multiple microphones, multi-band radios with tunable RF MEMS capacitors, MEMS […]

MEMS+ 4.0: Removing the Barrier between MEMS and ASIC designers

MEMS sensors never stand on their own – there’s always an accompanying ASIC that conditions the MEMS output or controls the MEMS. We’ve written frequently in past blogs and white […]

Virtual Fabrication: Not just for ICs. Better insight into manufacturing helps MEMS designers, too.

With the current focus on IC processing challenges at sub-20nm device length scales, interest in micron-scale wafer processing seems to be out of the limelight. However, in the world of […]

Predicting the Future of MEMS

Technology market analysts have a long and storied history of making bold predictions and eye-opening forecasts for growth in the industries they follow. Many, if not most, of these tend […]

Our persistent quest for more accuracy, speed and capacity

During a visit to a prospective customer a few months ago, a MEMS design manager told me that her philosophy is that a simulation is not worth doing if it […]

A Trillion Sensors? Not so unbelievable

There is no doubt that MEMS is an interesting market to watch within the semiconductor sector. Various market researchers forecast it to continue to outpace the growth of the overall […]

When will we get 3D NAND Flash Memory???

It’s about time for 3D NAND Flash, the agreed-upon “future of memory technology” to stop being the future and start being the present. The concepts all make sense. DRAM scaling […]

Will there ever be a “standard” MEMS process?

The lack of a standard MEMS process has long been bemoaned by those inside and outside the MEMS industry. Standard CMOS processes, after all, have been a key enabler of […]

IBM, Coventor present 22nm virtual fabrication success at SISPAD

IBM and Coventor jointly presented a paper at the 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). The paper presents a technology development methodology that relies on […]

Coventor provides a chapter for latest book on MEMS design: System-level Modeling of MEMS.

A new and very comprehensive book on MEMS design is now available, and we are proud to point out that a couple of Coventor MEMS experts have provided the first […]

New MEMS Design Ecosystem Evolving to Meet Changing Market Demands

The MEMS market is exploding as smart phones, tablets, games and other mobile devices swallow billions of components. Motion processing and location sensing technologies are central to the functionality of […]

Latest foundry results underscore the change in MEMS ecosystem

There’s little doubt that the MEMS ecosystem is changing quickly as these devices become ubiquitous, especially in consumer products. The cost and time pressures involved in developing cell phones, games, […]

Standardization plays an important role in MEMS integration

Easier integration through standards In a previous post, I discussed the challenges of MEMS integration and primarily looked at design methodology improvements that could help address the issues engineers face. […]

MEMS integration: A Matter of Perspective

MEMS integration means different things to different audiences. To pioneers in the MEMS industry, integration may imply a monolithic fabrication process, in which the MEMS and accompanying CMOS electronics are […]

Coventor’s Stephen Breit Highlighted as Featured Speaker at MEPTEC MEMS Symposium

Coventor’s Stephen Breit will be one of the featured speakers at the upcoming MEPTEC MEMS Technology Symposium.  Dr. Breit, who is V.P. of Engineering at Coventor,  will speak about realizing […]

The Value of Time

It was an honor to participate in the MEMS Forum sponsored by SEMI and A-Star Institute of Microelectronics.   Coventor had the pleasure of sharing the stage with founding members of […]

MEMS market is Exploding – Are you Ready for the Challenges of Consumerization?

Revenue growth for MEMS is expected to be nothing short of explosive according to industry analysts and recent press reports. Jérémie Bouchaud, director and principal MEMS and sensors analyst for […]

Coventor Gets to Know MEMS Community in Israel

On Tuesday March 12, Coventor hosted an informational seminar in Caesarea, Israel with the help of local MEMS company, Maradin, who provided very generous assistance in organizing the event, helping […]

Coventor showcases MEMS design advances at IEEE MEMS 2012

Coventor had its latest MEMS design solutions on display at the recent IEEE MEMS 2012 conference in Paris. The annual gathering of MEMS experts attracted more than 700 attendees from […]

WiSpry RF MEMS wins big with Samsung Flash

Congratulations to our friends at WiSpry on their recent big design win for enabling the first mass-produced RF MEMS-enabled wireless handset. The company’s unique WS2017 Tunable Impedance Match (TIM) circuit […]

Intel Announces Production-Ready 22nm 3-D Tri-Gate Transistor

Yesterday Intel announced its readiness for high-volume manufacturing of 3-D tri-gate (FinFET) transistors. Among other benefits, the tri-gate configuration allows Intel to manufacture higher performance fully-depleted devices without resorting to […]

Process Simulation vs. Process Emulation: is SEMulator3D really TCAD?

I was interested to note that Silvaco has recently listed SEMulator3D as a competitor for their VICTORY Process Cell software on their website. It’s great to be mentioned as a […]

New Release of SEMulator3D® Now Available

  We are pleased to announce that the 2011 version of Semulator3D is now available to customers. The production proven tool, used by some of the world’s leading IC and […]

Virtual fabrication is a more productive way to build integrated MEMS/CMOS systems than process simulation.

Dalsa Semiconductor and Coventor have published an article on the use of virtual fabrication for MEMS processing. Virtual fabrication process emulation backed up by experimental calibration is a more productive […]

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