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Fig 1: Geometrical CFET evolution from a 2 Nanowires-On- 2 Fins architecture to 2 Nanosheets-On- 2 Nanosheets architecture (NW: Nanowire, NS: Nanosheet, S: Source, D: Drain)
Introducing Nanosheets into Complementary-Field Effect Transistors (CFET)
May 26, 2020
Figure 4: SEMulator3D model of the Spacer 1 Oxide Fin CD after PMC.   The oxide spacer is turquoise, and the red etch stop layer is amorphous silicon. TEM image with the SEMulator3D image aligned to show visual comparison. Note that sidewall angle and line to line measurements can be used with Process Model Calibration to tune for the deformation caused by the mandrel removal.  
Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models
July 21, 2020

Enabling Better MEMS from Concept to High Volume Manufacturing

Published by Gerold Schropfer at June 26, 2020
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  • HVM
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Virtually every MEMS and sensor device inside the latest electronic products has been made using Lam Research equipment

Virtually every MEMS and sensor device inside the latest electronic products has been made using Lam Research equipmentLam Research® is one of the top equipment suppliers in the semiconductor ecosystem. As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler of the silicon roadmap. In fact, today, nearly every advanced memory and logic chip is built with Lam technology, requiring nanometer or even atomic-scale precision.

MEMS are fabricated using materials and processes similar to those used in semiconductor manufacturing but on a much larger scale, typically micrometer dimensions. This is not to say that the technical challenges manufacturers face are less demanding, but that the requirements can be quite different, often involving unique structures and different materials.  Accelerometers and gyros require dimensional control beyond what we can easily see, down to a very few nanometers. In many cases, MEMS devices can be fabricated using tools and processes originally developed for older, larger semiconductor nodes but now selectively enhanced with new technologies and lessons learned at the cutting-edge.

Lam’s acquisition of Coventor® has created an enabling partnership to support the MEMS Industry. Faster time to market, better predictability of device and system performance, improved device yield and increased productivity in high volume manufacturing are becoming increasingly critical requirements for MEMS companies. Lam Research and Coventor are unique in being able to support these requirements by offering a broad range of modeling and production-proven process technologies.

At the very start of the MEMS development process, we offer a unique and powerful platform for MEMS design, simulation and verification, CoventorMP®. This platform addresses MEMS-specific engineering challenges such as multi-physics interactions, process variations, MEMS + IC integration, and MEMS + package interaction. Using these tools, engineers can model and simulate device behavior and interactions before committing to actual fabrication. In a few hours or days, they can model or simulate effects that would have taken months of building and testing in the fab.

Then, Lam Research can support the ramp of proven designs into high volume products by offering a range of MEMS specific deposition, etch and clean solutions that draw on advanced CMOS fabrication capabilities to deliver best in class MEMS manufacturing performance.

Central to Lam’s MEMS Strategy is our ability to increase speed to solution and reduce time to market. Lam is leveraging advanced tool features to solve the most difficult challenges in MEMS manufacturing. As a part of the Lam family, Coventor further enhances the company’s leading position in MEMS manufacturing. Together we are unique in being able to support our customers’ requirements by offering a broad range of design, modeling and production-proven process technologies. Coventor and Lam are focused on delivering together enabling solutions that allow our customers to address today’s High-Volume-Manufacturing and tomorrow’s next generation device requirements.

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Gerold Schropfer
Gerold Schropfer
Dr. Gerold Schröpfer is Technical Director for Europe and for the MEMS business operations worldwide. For the last ten years, Gerold has been responsible for overseeing Coventor’s European MEMS and semiconductor business activities, including the management of R&D programs, industrial and academic partnerships, and external business relationships. Dr. Schröpfer has more than 20 years of relevant experience in MEMS and semiconductor design, process development and EDA product development. Prior to his current position at Coventor, Gerold carried out pioneering work in the design and development of inertial, tire pressure and magnetic sensors at Sensitec and SensoNor (Infineon). Dr. Schröpfer holds a PhD in engineering science from the University of Neuchâtel (Switzerland) and Franche-Comté (France), as well as a degree in physics from the University of Giessen (Germany).

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