By Mark Lapedus
The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices.S
caling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some options are already here, while others are still in R&D and require more funding to get off the ground. Some may never work.