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  • Coventor Ships Latest Version of MEMS+IC Co-Design Platform to Accelerate Development of Complex 3D Electronics Systems
Temperature-induced package effects on z-axis zero offset of a 3-axis accelerometer, simulated in MEMS+ 3.0 design environment
Coventor Strengthens Industry’s Only Integrated MEMS+IC Co-Design Solutions with Advanced 3D Modeling in Newest Version of MEMS+ Platform
November 7, 2012
SEMulator3D predictive physical model of contacts under nominal conditions (no contact overlay error), (b) TEM image from literature showing effect of contact overlay error, (c) SEMulator3D model under similar overlay error conditions and (d) source/drain contact area from Virtual Metrology for various overlay conditions explored in Expeditor
Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy and Automation Breakthroughs
May 28, 2013

Coventor Ships Latest Version of MEMS+IC Co-Design Platform to Accelerate Development of Complex 3D Electronics Systems

Published by Coventor at February 4, 2013
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Drive and sense modes of a dual-axis gyro simulated in MEMS+ (left), reduced-order Verilog-A model with Coriolis and DC bias non-linearities in a circuit schematic (upper right)and transient simulation of drive amplitude and sense output (lower right)

Drive and sense modes of a dual-axis gyro simulated in MEMS+ (left), reduced-order Verilog-A model with Coriolis and DC bias non-linearities in a circuit schematic (upper right)and transient simulation of drive amplitude and sense output (lower right)

MEMS+ 3.0 software platform delivers new fluidic, package and noise simulation capabilities; an expanded component library; and performance enhancements

CARY, North Carolina – February 4, 2013 – Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today announced immediate availability of its new MEMS+® 3.0 design platform that accelerates development of complex 3D systems with state-of-the-art actuators, accelerometers and gyroscopes, microphones and other types of MEMS devices.

The MEMS+ 3.0 platform enables MEMS designers to explore device concepts and optimize designs much faster than using conventional field solvers. It also bridges the gap between the accuracy required by MEMS designers and the simulation speed required by ASIC designers with a common model for MEMS and ASIC co-design that eliminates months of engineering effort.

Key to delivering these advantages are MEMS+ 3.0 advancements focused on more accuracy with new high-order beam, shell and brick elements; new physics such as squeezed-film gas damping in transient simulations of MEMS actuators; and simulations of package thermal deformation effects on MEMS sensors. In particular, the addition of fluidics to the existing mechanical and electrostatic modeling capabilities of the platform enables fully coupled simulations to predict performance metrics like noise or actuation time previously realized only through costly build-and-test cycles.

“As the industry’s only MEMS+IC co-design platform, Coventor’s MEMS+ offering has been a key driver in the development of MEMS devices in many of today’s consumer electronics, such as smart phones and tablets. We expect that the MEMS+ 3.0 platform will similarly impact the advent of innovations in other more advanced and emerging markets, such as energy harvesting and RF MEMS,” said Coventor’s CEO Mike Jamiolkowski.

Integrated MEMS+IC Co-Design Platform

The MEMS+ 3.0 platform is built on speed, capacity and integration improvements implemented across the entire software suite, including a built-in simulator, parallel processing support, selective linearization, and more complete scripting interfaces.

The built-in simulator handles basic MEMS analysis tasks, making it easy to verify models before exporting to the MATLAB or Cadence Design Systems environments. The parallel processing support for Simulink and the Cadence APS simulator ensures that simulation speed scales well on multi-core and multi-processor systems. Selective linearization of model components further enhances simulation speed, enabling MEMS+ models to simulate as fast as handcrafted models while retaining key non-linear effects. Full scripting interfaces are available in both MATLAB and Python scripting consoles so users can automate entire flows from design creation to simulation and post processing, saving time and producing better designs through more extensive parameter studies.

Availability

The MEMS+ 3.0 design platform is now shipping. For more detailed product information and to download the new software release, users can visit: https://www.coventor.com/support/software-downloads/.
About Coventor

Coventor, Inc. is the market leader in automated design solutions for micro-electromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. Coventor serves a worldwide customer base of integrated device manufacturers, fabless design houses, independent foundries, and R&D organizations that develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Coventor’s software tools and expertise enable its customers to simulate and optimize MEMS device designs and fabrication processes before committing to time-consuming and costly build-and-test cycles. The company is headquartered in Cary, North Carolina and has offices in California’s Silicon Valley, Cambridge, Massachusetts, and Paris, France. More information is available at https://www.coventor.com.

—end—

Coventor and MEMS+ are registered trademarks of Coventor, Inc. All other trademarks are the property of their respective owners.

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