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Close-up of MEMS accelerometer 3D simulation with a hex-dominant mesh generated with new CoventorWare 2012 software.
CoventorWare 2012 Software Increases 3D Simulation Capacity and Accuracy to Ease Verification of Complex MEMS Devices
January 30, 2012
Coventor Names IBM Semiconductor Process Expert David Fried as CTO
August 7, 2012

Coventor’s SEMulator3D 2012 Software Release Increases Speed and Accuracy of MEMS and Semicondutor Process Development

Published by Coventor at April 9, 2012
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64-bit support with performance and ease of use enhancements focus on process modeling and integration challenges at 28nm and beyond

 CARY, North Carolina – April 9, 2012 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for micro-electromechanical systems (MEMS) and semiconductor devices, today announced immediate availability of the latest release of its SEMulator3D® software. SEMulator3D 2012 raises the bar for predictive process modeling tools with increased capacity, speed and automation advancements to accelerate development of leading-edge process technology nodes.

The SEMulator3D 2012 release provides full support for 64-bit operating systems and 3D visualization speed improvements that make it possible to model devices in finer detail, down to the sub-nanometer level, and work with larger areas on the die. In addition, the assignment of boundary conditions for all process steps is now fully automated by the software. These new capabilities remove barriers to adopting virtual fabrication for advanced process development and significantly improve the productivity of SEMulator3D users.

“Semiconductor process technology has entered an era where geometric scaling alone is not sufficient to keep up with the front-end technology roadmap,” according to Mike Jamiolkowski, CEO of Coventor. “SEMulator3D has proven that it can help compress the technology development timeline and provide a rapid return on investment.”

SEMulator3D Virtual Fabrication

SEMulator3D virtual fabrication is quite distinct from conventional TCAD simulation software: it has the capacity and speed to model the complete front-end fabrication sequence rather than a few steps at a time. In addition, SEMulator3D has the flexibility to accurately model any device type and is fast enough to model all possible device variations, enabling users to predict process defect modes and reduce the number of scrap wafers.

SEMulator3D software has been successfully deployed by the world’s leading semiconductor companies for process integration of advanced logic and memory technology nodes, including 22-nanometer (nm) logic technology. The software is now being applied to accelerate development of the upcoming 14nm and 10nm nodes. SEMulator3D is also used by leading MEMS integrated device manufacturers (IDMs) and MEMS foundries for process development and design verification prior to tape out. Emerging applications for SEMulator3D include design rule development, failure analysis, and metrology.

Availability

The SEMulator3D 2012 releaseis shipping today.

About Coventor

Coventor, Inc. is the market leader in automated design solutions for micro-electromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. Coventor serves a worldwide customer base of integrated device manufacturers, fabless design houses, independent foundries, and R&D organizations that develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Coventor’s software tools and expertise enable its customers to simulate and optimize MEMS device designs and fabrication processes before committing to time-consuming and costly build-and-test cycles. The company is headquartered in Cary, North Carolina and has offices in California’s Silicon Valley, Cambridge, Massachusetts, and Paris, France. More information is available at https://www.coventor.com.


—end—

Coventor and SEMulator3D are registered trademarks of Coventor, Inc.  All other trademarks are the property of their respective owners.

Note to Editors: Digital images are available.

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