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Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and microsystem technology development
November 17, 2020
Coventor Delivers a Breakthrough in Advanced MEMS Design Capabilities
July 17, 2020

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In situ Metrology for Etch Endpoint Detection
November 8, 2022
Creating Airgaps to Reduce Parasitic Capacitance in FEOL
October 27, 2022

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Figure 2. Virtual metrology results for minimum and maximum area.

Pathfinding by process window modeling: Advanced DRAM capacitor patterning process window evaluation using virtual fabrication

DRAM, Lithography and Patterning, Process Window Optimization, SEMulator3D

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