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  • Design Technology Co-Optimization of 3D-monolithic standard cells and SRAM exploiting dynamic back-bias for ultra-low-voltage operation

    Read more - Design Technology Co-Optimization of 3D-monolithic standard cells and SRAM exploiting dynamic back-bias for ultra-low-voltage operation
    Different top level inverter layouts exploiting double gate mode vs Ref

    Design Technology Co-Optimization of 3D-monolithic standard cells and SRAM exploiting dynamic back-bias for ultra-low-voltage operation

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  • Understanding how small variations in photoresist shape significantly impact multi-patterning yield

    Read more - Understanding how small variations in photoresist shape significantly impact multi-patterning yield
    fin-patterning-for-FinFETs

    Understanding how small variations in photoresist shape significantly impact multi-patterning yield

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  • FinFET Front End of Line FEOL Process Integration

    Read more - FinFET Front End of Line FEOL Process Integration
    Cross-sectional comparison of Replacement Metal Gate stack

    FinFET Front End of Line FEOL Process Integration

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