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  • A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM

    Read more - A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
    wiggling AA figure

    A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM

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  • A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

    Read more - A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

    A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

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  • A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow

    Read more - A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow
    beol two level metal integration flow

    A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard N5 BEOL two-level metal flow

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  • Defect Evolution in Next Generation, Extreme Ultraviolet Lithography

    Read more - Defect Evolution in Next Generation, Extreme Ultraviolet Lithography
    Multilayer stack

    Defect Evolution in Next Generation, Extreme Ultraviolet Lithography

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  • 3D NAND Flash Processing

    Read more - 3D NAND Flash Processing
    3D NAND flash memory array, based on TCAT [1], with 16 cells per string, top gate-select layer and bottom source-select layer.

    3D NAND Flash Processing

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