Schematic fabrication process of seismometer
A Sub-1 Hz Resonance Frequency Resonator Enabled by Multi-Step Tuning for Micro-Seismometer
January 8, 2022
MEMS-gyroscope-and-package-joined
Thermo-Mechanical Simulation of Die-Level Packaged 3-axis MEMS Gyroscope Performance
March 30, 2018

Whitepaper: New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

To download your free white paper, please fill out the form below:

This paper presents the benefits of using statistical models during MEMS design, through the virtual reproduction of a test structure for measuring a beam’s pull-in voltage. This electrical measurement is used as a functional indicator of the process quality for manufactured wafers. Statistical variations of process parameters (material properties, silicon thickness, sidewall angle and edge shift due to etching tolerances) are included in our study using a MEMS Process Design Kit. This statistical data is used during Monte Carlo simulation, to evaluate the influence of expected manufacturing variability on the performance of our test structure.

You might also be interested in: