Lithography and Patterning Archives | Coventor

Backside Power Delivery as a Scaling Knob for Future Systems
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Backside Power Delivery as a Scaling Knob for Future Systems
Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
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Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
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Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
CMOS Area Scaling and the Need for High Aspect Ratio Vias
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CMOS Area Scaling and the Need for High Aspect Ratio Vias
Process Modeling Exploration for 8 nm Half-Pitch Interconnects
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Process Modeling Exploration for 8 nm Half-Pitch Interconnects
N7 FinFET Self-Aligned Quadruple Patterning Modeling
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N7 FinFET Self-Aligned Quadruple Patterning Modeling
Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
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Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip
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Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip
Understanding how small variations in photoresist shape significantly impact multi-patterning yield
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Understanding how small variations in photoresist shape significantly impact multi-patterning yield