SEMulator3D Archives | Coventor

A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication
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A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication
Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
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Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
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A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
Speeding Up Process Optimization with Virtual Processing
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Speeding Up Process Optimization with Virtual Processing
Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD
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Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD
Backside Power Delivery as a Scaling Knob for Future Systems
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Backside Power Delivery as a Scaling Knob for Future Systems
Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
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Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
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Virtual Fabrication and Advanced Process Control Improve Yield for SAQP Process Assessment with 16 nm Half-Pitch
CMOS Area Scaling and the Need for High Aspect Ratio Vias
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CMOS Area Scaling and the Need for High Aspect Ratio Vias