• A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM

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  A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM

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• Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models

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  Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models

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• A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication

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  A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication

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• Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning

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  Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning

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• A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

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  A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

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• Speeding Up Process Optimization with Virtual Processing

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  Speeding Up Process Optimization with Virtual Processing

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• Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD

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  Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD

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• Backside Power Delivery as a Scaling Knob for Future Systems

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  Backside Power Delivery as a Scaling Knob for Future Systems

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• Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond

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  Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond

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