SEMulator3D Archives - Page 2 of 5 - Coventor

A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
Read more - A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
A Study of Wiggling AA Modeling and its Impact on Device Performance in Advanced DRAM
Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models
Read more - Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models
Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication
Read more - A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options done by Virtual Fabrication
Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
Read more - Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
Impact of EUV Resist Thickness on Local Critical Dimension Uniformities for <30 nm CD Via Patterning
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
Read more - A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
Speeding Up Process Optimization with Virtual Processing
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Speeding Up Process Optimization with Virtual Processing
Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD
Read more - Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD
Advances in 3D CMOS Image Sensors Optical Modeling: Combining Realistic Morphologies with FDTD
Backside Power Delivery as a Scaling Knob for Future Systems
Read more - Backside Power Delivery as a Scaling Knob for Future Systems
Backside Power Delivery as a Scaling Knob for Future Systems
Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Read more - Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond
Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond