IBM and Coventor jointly presented a paper at the 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). The paper presents a technology development methodology that relies on […]
Latest release of the industry’s only ‘virtual fabrication’ platform delivers advanced physics-driven predictive modeling capabilities aimed at reducing silicon learning cycles and costs CARY, North Carolina – May 28, 2013 […]
A new and very comprehensive book on MEMS design is now available, and we are proud to point out that a couple of Coventor MEMS experts have provided the first […]
MEMS+ 3.0 software platform delivers new fluidic, package and noise simulation capabilities; an expanded component library; and performance enhancements CARY, North Carolina – February 4, 2013 – Coventor®, Inc., the […]
Advanced 3D Modeling in Newest Version of MEMS+ Platform MEMS+ 3.0 features new fluidic, package and noise simulation capabilities; an expanded component library; and performance enhancements to accelerate overall throughput […]
IBM veteran with deep experience in advanced process technology including SOI and FinFETs to lead strategic direction in the development efforts for virtual fabrication solutions for 22nm and beyond CARY, […]
The MEMS market is exploding as smart phones, tablets, games and other mobile devices swallow billions of components. Motion processing and location sensing technologies are central to the functionality of […]
There’s little doubt that the MEMS ecosystem is changing quickly as these devices become ubiquitous, especially in consumer products. The cost and time pressures involved in developing cell phones, games, […]
Easier integration through standards In a previous post, I discussed the challenges of MEMS integration and primarily looked at design methodology improvements that could help address the issues engineers face. […]
MEMS integration means different things to different audiences. To pioneers in the MEMS industry, integration may imply a monolithic fabrication process, in which the MEMS and accompanying CMOS electronics are […]