October 15, 2022
Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The […]
September 17, 2021
We are very pleased to announce the release of our latest MEMS design software, CoventorMP® 2.0! With the new release, automated parametric design variation for simulation in both MEMS+® and […]
May 20, 2021
RF MEMS switches are small, micromechanical switches that have low power consumption and can be produced using conventional MEMS fabrication technology. They are similar to a light switch in a […]
February 17, 2021
Guest Author: Jérôme Juillard, Ph.D., Professor, CentraleSupélec (Paris-Saclay University) Every year, I teach different aspects of sensors and MEMS design to about a hundred students. The pupils range from first […]
November 17, 2020
Coventor’s SEMulator3D and CoventorMP MEMS Design Platform now available to startups and researchers across Canada’s National Design Network MONTREAL and FREMONT, Calif. – November 17, 2020 – Coventor®, a Lam Research Company, […]
November 16, 2020
When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As […]
July 17, 2020
CoventorMP® 1.3 Enhances Device Construction, Modeling Capabilities and Simulation Performance to Accelerate the Development of Next-Generation MEMS Technology Fremont, CA—JULY 17, 2020 – Coventor®, a Lam® Research Company, the global […]
October 16, 2019
We are very pleased to announce the release of our latest MEMS design software, CoventorMP 1.2. This release has been enriched to improve the accuracy of device models and extend the […]
July 8, 2019
New Features Enable SEMulator3D 8.0 to Address Both Process Modeling and Device Analysis for Better Insight into Advanced Semiconductor Technology Development
October 12, 2018
Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the […]