August 24, 2020
Figure 2: Example of a device package.

Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip, to encompassing a growing number of schemes for interconnecting multiple types of chips. […]
August 8, 2017
Example test photonic IC, with common elements such as waveguides, grating coupler, MZI, photodetector and fill pattern.

Silicon Photonics: Solving Process Variation and Manufacturing Challenges

As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide shape and can result […]
October 18, 2016

Achieving the Vision of Silicon Photonics Processing

With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable.   Copper cabling cannot keep up with the upcoming data […]
March 12, 2015
Example of a 3D NAND flash memory array.

Defect Evolution in 3D NAND Flash

3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology […]
Request Demo