December 19, 2022
![Figure 2. Backside power delivery using buried power rails, based on [2] (not to scale).](https://www.coventor.com/wp-content/uploads/2022/12/Figure-2-December-2022-Coventor-website-blog-from-Sandy-Wen-960x720.png)
At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew […]
November 16, 2021
When evaluating shrinking metal linewidths in advanced semiconductor devices, bulk resistivity is not the sole materials property for deriving electrical resistance. At smaller line dimensions, local resistivity is dominated by […]
August 24, 2020
Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics
Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip, to encompassing a growing number of schemes for interconnecting multiple types of chips. […]
August 8, 2017
As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide shape and can result […]
October 18, 2016
With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable. Copper cabling cannot keep up with the upcoming data […]
March 12, 2015
3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology […]