July 21, 2020
Figure 4: SEMulator3D model of the Spacer 1 Oxide Fin CD after PMC.   The oxide spacer is turquoise, and the red etch stop layer is amorphous silicon. TEM image with the SEMulator3D image aligned to show visual comparison. Note that sidewall angle and line to line measurements can be used with Process Model Calibration to tune for the deformation caused by the mandrel removal.  

Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models

Process engineers and integrators can use virtual process modeling to test alternative process schemes and architectures without relying on wafer-based testing. One important aspect of building an accurate process model […]
May 21, 2019

Challenges and Solutions for Silicon Wafer Bevel Defects during 3D NAND Flash Manufacturing

As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between the wafer […]
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