July 31, 2019
Top view of slit and channel hole at different nodes

Advanced Patterning Techniques for 3D NAND Devices

Driven by Moore’s law, memory and logic semiconductor manufacturers pursue higher transistor density to improve product cost and performance [1]. In NAND Flash technologies, this has led to the market […]
April 13, 2018
Example of metal connections in Back End of Line (BEOL) development, and highlighted hotspots.

Advanced 3D Design Technology Co-Optimization for Manufacturability

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due […]
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