June 29, 2014
![MEMS Gyroscope Design Example: Murata 3-axis gyroscope modeled in the MEMS+ module of CoventorMP with overlay of measured and simulated data for static capacitance and X-axis sense mode shift with X-axis sense bias variation [1,2]](https://www.coventor.com/wp-content/uploads/2019/08/GyroscopeDesignResults-960x720.png)
CoventorWare 2014 delivers new levels of performance, automation and accuracy to address most complex MEMS design challenges CARY, North Carolina – June 30, 2014 – Coventor®, Inc., the leading supplier […]
June 26, 2014
Coventor attended the Solid State Sensors, Actuators and Microsystems Conference last week, known simply as “Hilton Head” to the North American MEMS and nanotechnology community. This is a delightful conference […]
May 23, 2014
![3D NAND flash memory array, based on TCAT [1], with 16 cells per string, top gate-select layer and bottom source-select layer.](https://www.coventor.com/wp-content/uploads/2014/05/TCAT_whole_bf-M1-marked1.png)
With 2D planar NAND flash hitting scaling issues at sub-20nm technology nodes, 3D NAND flash has become all the rage. Instead of restricting memory cells to a single plane and […]
May 6, 2014
Once again we are entering the final phase of a MEMS+ release cycle. We are tying up loose endsfor for another exciting release, over the summer, of our unique MEMS […]
April 8, 2014
I often feel that Coventor is in the crow’s nest for spotting trends in the MEMS industry because our customers use design and simulation software early in the product development […]
March 30, 2014
We’re right on the cusp of the SEMulator3D 2014 release. This has been a big release in the making, and I know I’m not alone in my excitement as we […]
March 29, 2014
New pattern dependent etch modeling capability highlights improvements in speed and accuracy for FinFETs, 3D memory, BEOL interconnect and other advanced manufacturing technologies CARY, North Carolina – March 31, 2014 […]
March 18, 2014
As semiconductor technology scales into the 20nm node and beyond, the process complexity, electrical performance and circuit density tradeoff becomes extremely difficult to optimize. As the demand for increased density, […]
March 16, 2014
3D printing has become all the rage in many areas, from home hobbyists to high-end industrial applications. The convenience, flexibility, functionality and decreasing price for printing things in 3D makes […]
February 10, 2014
The recent IEEE Conference on MEMS, held in San Francisco, was one of the better gatherings of its sort, partly due to the location and its proximity to so many […]