March 8, 2021
Static Random-Access Memory (SRAM) has been a key element for logic circuitry since the early age of the semiconductor industry. The SRAM cell usually consists of six transistors connected to […]
February 22, 2021
While contact gate pitch (GP) and fin pitch (FP) scaling continues to provide higher performance and lower power to FinFET platforms, controlling RC parasitics and achieving higher transistor performance at […]
February 17, 2021
Guest Author: Jérôme Juillard, Ph.D., Professor, CentraleSupélec (Paris-Saclay University) Every year, I teach different aspects of sensors and MEMS design to about a hundred students. The pupils range from first […]
January 19, 2021
How can virtual process libraries accelerate semiconductor process development? Process engineers develop ideal solutions to engineering problems using a logical theoretical framework combined with logical engineering steps. Unfortunately, many process […]
December 14, 2020
New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes in […]
November 17, 2020
Coventor’s SEMulator3D and CoventorMP MEMS Design Platform now available to startups and researchers across Canada’s National Design Network MONTREAL and FREMONT, Calif. – November 17, 2020 – Coventor®, a Lam Research Company, […]
November 16, 2020
When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As […]
October 23, 2020
In a DRAM structure, the charging and discharging process of capacitor-based memory cells is directly controlled by the transistor [1].With transistor sizes approaching the lower limits of physical achievability, manufacturing […]
September 23, 2020
In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (Figure 1). This has an impact on […]
August 24, 2020
Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics
Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip, to encompassing a growing number of schemes for interconnecting multiple types of chips. […]