July 21, 2020

Process Model Calibration: The Key to Building Predictive and Accurate 3D Process Models

Process engineers and integrators can use virtual process modeling to test alternative process schemes and architectures without relying on wafer-based testing. One important aspect of building an accurate process model […]
July 17, 2020

Coventor Delivers a Breakthrough in Advanced MEMS Design Capabilities

CoventorMP® 1.3  Enhances Device Construction, Modeling Capabilities and Simulation Performance to Accelerate the Development of Next-Generation MEMS Technology Fremont, CA—JULY 17, 2020 – Coventor®, a Lam® Research Company, the global […]
June 26, 2020

Enabling Better MEMS from Concept to High Volume Manufacturing

Lam Research® is one of the top equipment suppliers in the semiconductor ecosystem. As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler […]
May 26, 2020

Introducing Nanosheets into Complementary-Field Effect Transistors (CFET)

UNDERSTANDING THE BENEFITS AND CHALLENGES OF A NEW, NEXT-GENERATION SEMICONDUCTOR ARCHITECTURE In our November 2019 blog [1], we discussed using virtual fabrication (SEMulator3D®) to benchmark different process integration options for […]
April 17, 2020

Identifying and Preventing Process Failures at 7nm

Using failure bin classification, yield prediction and process window optimization to predict and enhance yield Device yield is highly dependent upon proper process targeting and variation control of fabrication steps, […]
April 15, 2020

Cutting-Edge MEMS Process, Device and Simulation Technologies: IEEE MEMS 2020 Conference Review

The IEEE MEMS conference was held in Vancouver during January 2020. We attended the conference to meet with our customers and to see what new developments are being made in […]
March 24, 2020

Exploring the Impact of EUV Resist Thickness on Via Patterning Uniformity using a Litho/Etch Modeling Platform

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation […]
February 20, 2020

The Next Technology Frontier in MEMS Gyroscopes

In MEMS technology development, it is always exciting to see the next technology frontier, the border of the known and the unknown. Talent and hard work (along with ingenuity) can […]
January 29, 2020

Identifying DRAM Failures Caused by Leakage Current and Parasitic Capacitance

Leakage current has been a leading cause of device failure in DRAM design, starting with the 20nm technology node. Problems with leakage current in DRAM design can lead to reliability […]
December 16, 2019

An Introduction to Semiconductor Process Modeling: Process Specification and Rule Verification

Semiconductor process engineers would love to develop successful process recipes without the guesswork of repeated wafer testing. Unfortunately, developing a successful process can’t be done without some work. This blog […]