March 14, 2022
Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for […]
February 15, 2022
What is 3D Solid Modeling? You’ve certainly heard of “3D Solid Modeling”. The term first originated in the verification engineering community and has now become nearly ubiquitous. Mainstream industries like […]
February 11, 2022
Design of Experiments (DOE) is a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and their effect […]
January 19, 2022
In any given year, we expect about 16 major earthquakes worldwide, 15 of which are in the magnitude 7 range and one in the magnitude 8.0 range or greater [1]. […]
January 4, 2022
When I was a small child, I remember watching a 1966 American sci-fi adventure movie called “Fantastic Voyage” (the Korean title was “Micro Squad”) on an old black-and-white TV. The […]
December 14, 2021
A digital twin is a digital representation of a real-world item, and includes software objects or models that represents these real-world items. In MEMS product development, digital twins (or software […]
December 3, 2021
The Effect of Pattern Loading on BEOL Yield and Reliability during Chemical Mechanical Planarization
CMP (Chemical mechanical planarization) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during semiconductor manufacturing, […]
November 16, 2021
When evaluating shrinking metal linewidths in advanced semiconductor devices, bulk resistivity is not the sole materials property for deriving electrical resistance. At smaller line dimensions, local resistivity is dominated by […]
October 27, 2021
Despite the growing interest in EUV lithography, self-aligned quadruple patterning (SAQP) still holds many technical advantages in pattern consistency, simplicity, and cost. This is particularly true for very simple and […]
September 17, 2021
We are very pleased to announce the release of our latest MEMS design software, CoventorMP® 2.0! With the new release, automated parametric design variation for simulation in both MEMS+® and […]